Soldering Paste

Soldering Paste





Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by printing solder paste in/over the holes. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringeand then the components are put in place by a pick-and-place machine or by hand.


General Type: Soldering Paste
Material: Soldering Paste
Special function: Welding IC PCB BGA SMD PC Board
Size and Weight Product weight: 0.021 kg
Package weight: 0.081 kg
Product size (L x W x H): 5 x 5 x 1 cm / 1.97 x 1.97 x 0.39 inches
Package size (L x W x H): 19 x 12 x 3 cm / 7.47 x 4.72 x 1.18 inches
Packing List Package Contents: 1 x GOOT BS – 10 Soldering Paste Grease 10g

Additional information

Weight 0.1 kg