*100% brand new and high quality
*Made of high-quality materials, durable
*The multifunctional template basically covers the current general-purpose BGA chips.
*It can be heated by an air, and the template is not easily deformed by heat.
*The grid design can reduce the waste of solder balls.
*Simple and convenient to use.
*It solves the trouble when the computer maintenance engineer uses the direct heating steel mesh. It is durable.
*The success rate of tin planting is very high, and solder balls can be formed at one time when proficient.