High Quality 55 Kinds of Universal BGA Reballing Stencils Template for Mobile Phone PC IC Chip Solder Paste Tin Plate Net

Description

*100% brand new and high quality

*Made of high-quality materials, durable

*The multifunctional template basically covers the current general-purpose BGA chips.

*It can be heated by an air, and the template is not easily deformed by heat.

*The grid design can reduce the waste of solder balls.

*Simple and convenient to use.

*It solves the trouble when the computer maintenance engineer uses the direct heating steel mesh. It is durable.

*The success rate of tin planting is very high, and solder balls can be formed at one time when proficient.